Description: Three-dimensional Integration of Semiconductors : Processing, Materials, and Applications, Hardcover by Kondo, Kazuo (EDT); Takahashi, Kenji (EDT); Kada, Morihiro (EDT), ISBN 3319186744, ISBN-13 9783319186740, Like New Used, Free shipping in the US This book starts with backgroundconcerning three-dimensional integration - including theirlow energy consumption and high speed image processing - and then proceeds to how to construct them and which materials to use in particular situations.Th covers numerous applications, includingnext generation smart phones, driving assistance systems, capsule endoscopes, homing missiles, and many others. Th concludes with recent progress and developments in three dimensional packaging, as well as future prospects.
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Book Title: Three-dimensional Integration of Semiconductors : Processing, Mat
Number of Pages: Xix, 408 Pages
Publication Name: Three Dimensional Interconnects : Processing, Materials, and Advanced Applications
Language: English
Publisher: Springer International Publishing A&G
Subject: Physics / Condensed Matter, Electronics / Semiconductors, Chemistry / Physical & Theoretical, Electrical
Publication Year: 2015
Type: Textbook
Item Weight: 269 Oz
Item Length: 9.3 in
Subject Area: Technology & Engineering, Science
Author: Kenji Takahashi
Item Width: 6.1 in
Format: Hardcover
